Interesting. So do you think the coverage issues were due to the porous block or the application with putty knives? My theory with Sanitred was that the cavities of the block once covered over with the product would bubble due to the trapped air inside the cavities escaping. I think that would happen with any product.
Not sure about your senario, but for me it was a combination of the two. I spent two weeks grinding with a right angle grinder on my walls to get as prepared as possible, (making a huge mess of the house in process since this was all indoors) but getting a perfect surface proved impossible. This includes another week after the grinding of acid etching too. (which I don't recommend to anyone to do indoors) And I imagine my 8in thick poured walls would be easier to work on than your concrete block, not having mortar lines and the slightly more pourous hole problem.
So after all that work, here's what I dealt with on every square inch of work area: if I made a pass with the putty spreader and the application thickness was perfect, then there would be either more pinholes than usual, or there would be a high spot that would have to be dealt with. Or, as I opted to do, I put it on a little thicker than usual, but then gap filling from the high spots really ate up the product and I still had pin holes, albiet a lot less of them.
Basically, I'm not sure that any of these products can be applied with out having to go over it with a fine tooth comb once done. If any little spot seemed even the slightest bit questionable, I recovered it. Actually, when I did the floor, it went pretty much as advertised as it was a perfectly smooth surface with just the right texture for epoxy application. The wall was a nightmare.
Your symptom of being able to fill half way just almost sounds like you have a pin hole leak at that point or higher somewhere. And who knows how long it might take the leak to manifest itself since it has to make its way through the material an undeterminable distance before it can be visually noticed.